MILPITAS, CA – Worldwide silicon wafer shipments rose 3.1% year-on-year in the third quarter to 3,313 million square inches (MSI), according to the SEMI Silicon Manufacturers Group. The increase ...
FRANCE – The EIPC (European Institute for the PCB Community) is seeking abstracts for technical presentations at its Winter Conference, taking place February 3–4, 2026, in Aix-en-Provence, France.
Austin, Texas, November 4th 2025 – High Density Packaging User Group (HDP) is pleased to announce that the European Space Agency (ESA) has become a member.
Krailling, Germany – November 5th, 2025 – Photonics Systems Group (PSG), a leading expert in laser micromachining specifically for the electronics industry, today announced its inaugural after-hours ...
Austin, Texas, November 3, 2025 – High Density Packaging User Group (HDP) is pleased to announce that the Aoshikang Technology (Hong Kong) Co., Ltd (ASKPCB) has become a member.
Protecting design IP. Broadly speaking, the data in a design include the following categories. The design data in an ECAD/PCB ...
True 3-D interconnects and packaging. Rigid PCBs are inherently 2-D. Rigid-flex, however, allows you to fold, bend and twist ...
PEACHTREE CITY, GA – CIRCUITS ASSEMBLY today announced the 2025 New Product Introduction (NPI) Award winners for electronics assembly equipment, materials and software. The 18th annual NPI Awards ...
Stop designing products guaranteed to fail EMC testing. Au: This article emphasizes the need to concentrate on design of transmission lines, or the “spaces,” instead of the “wires.” The industry focus ...
Leveraging common fabrication processes to encapsulate transformers. Like embedded resistors and capacitors, embedded magnetics provide a means for reducing system size and cost. Transformers and ...
White solder resist Elpemer SD 2491 SG-TSW-R6-B has excellent yellowing resistance after Pb-free reflow soldering and high thermal loads. Has thermal cycling test resistance of 500 cycles between -40 ...
SEOUL – Doosan Corp. has launched mass production at its new flexible copper-clad laminate (FCCL) plant in Gimje, North Jeolla Province, targeting the fast-growing foldable smartphone and wearable ...
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