Abstract: Coarse intermetallic compound (IMC) formation can lead to brittleness and generate cracks between the solder and the IMC interface under printed circuit board (PCB) warpage. Microstructure ...
Abstract: A bidirectional multibeam transmit-reflect-array (TRA) antenna has been proposed for the space–air–ground–sea integrated network (SAGSIN). The TRA consists of alternating transmission ...
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